发明名称 |
Resin for sealing compound semiconductor, semiconductor device, and process for manufacturing it |
摘要 |
A resin for sealing a compound semiconductor is here disclosed which contains, as a matrix, a siloxane compound for producing a silicone resin by addition reaction and which has a group comprising the bond of an organic group and an oxy group. The group comprising the bond of the organic group and the oxy group bonds to a terminal of the molecule of the siloxane compound, and as this group comprising the bond, 0.1 to 10% by weight, preferably 0.1 to 1.5% by weight of an alkoxy group (-OR') is used. A compound semiconductor chip is covered with the resin for sealing the compound semiconductor and then reacted under predetermined conditions to produce a silicone resin and simultaneously to chemically bond a siloxane group (-Si-O-) in the silicone resin to an element in a portion of the compound semiconductor chip which comes in contact with the silicone resin.
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申请公布号 |
US5648687(A) |
申请公布日期 |
1997.07.15 |
申请号 |
US19940207165 |
申请日期 |
1994.03.08 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
MATSUO, YOSHIHIKO;KUSUDA, KAZUO;SATA, NAOKI;YOSHIKAWA, TOSHIHUMI;MATSUMURA, TSUNEO |
分类号 |
C08G77/00;C08G77/02;H01L21/56;H01L23/29;H01L23/31;H01L31/0203;H01L31/12;H01L33/30;H01L33/54;H01L33/56;H01L33/62;(IPC1-7):H01L23/28 |
主分类号 |
C08G77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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