| 摘要 |
PROBLEM TO BE SOLVED: To remove a discretionary electronic component without affecting the connection of the peripheral components by using a mechanism which selectively pulls up the electronic component into the heating medium supplied to the whole printed board after completing the melting of the connecting part of the electronic component. SOLUTION: A jig 7, which selectively pulls an electronic component, is installed to a printed board 1 whereupon an electronic component 2 is mounted by connecting with a connecting member such as soldering material. Then, the component is removed by using a heating device which heats the whole board 1 at one time by heating medium. The component pull-up mechanism 7 is composed of a component pull-up part 7a, a component holding part 7b and a component support 7c. The whole board 1 is heated at a temperature slightly higher than the melting temperature of the connecting part of the component 2, all component connecting parts which have the melting point below the heating temperature are completely re-melted, and the failure components are removed by using a removing jig. |
