| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform prealignment of a wafer at a high speed by a noncontact system while matching prealignment mechanism of a contact system. SOLUTION: An observation visual field 86C of a two-demensional image processing equipment is set on a notch part NP of a wafer 6N, and observation visual fields 86A, 86B of the two-dimensional image processing equipment are set on other two parts on the circumference of the wafer 6N. Virtual positions A, B, E corresponding to contact positions with reference pins of prealignment mechanism of contact system are set in the observation visual fields 86A-86C, respectively. Offset of the wafer 6N to the X direction, offset to the Y direction and rotation error are detected from the position deviation amount of edge positions C, D, F of the wafer 6N in the visual observation fields 86A-86C from the virtual positions A, B, F.</p> |
