| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to easily obtain a stable contact state by altering the structure of a carrier board at the electrode lower side to a mechanical drive mechanism. SOLUTION: The bare chip carrier to be mounted at the socket of a burn-in apparatus comprises a carrier board 2 mounted with a bare chip 1, and a cover 3 pressurized to the board 2 in the state that the chip 1 is mounted on the board 2. The bump 4 of the chip 1 is electrically connected by the pressure contact of the bump 4 with the electrode 5 of the board 2. An arm 7 integrated with the electrode 5 and a pressure receiving plate 8 exist in an air box 6 at the lower side of the electrode 5 of the board 2, the movement of the chip 1 is stopped at the contact sensing position of the initial bump 4 with the electrode 5, and then the box 6 is pressurized to positive pressure to urge the electrode 5 upward via the plate 8 and the arm 7 to take all the contacts.</p> |
