发明名称 |
Wireless circuit board system for a motor controller |
摘要 |
A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM TM interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.
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申请公布号 |
US5648892(A) |
申请公布日期 |
1997.07.15 |
申请号 |
US19950536224 |
申请日期 |
1995.09.29 |
申请人 |
ALLEN-BRADLEY COMPANY, INC. |
发明人 |
WIELOCH, CHRISTOPHER J.;BABINSKI, THOMAS E.;MATHER, JOHN C.;WOYCHIK, GERARD A.;MCLAUGHLIN, STEVEN R. |
分类号 |
H02M7/00;H05K1/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H02M7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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