发明名称 Wireless circuit board system for a motor controller
摘要 A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM TM interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.
申请公布号 US5648892(A) 申请公布日期 1997.07.15
申请号 US19950536224 申请日期 1995.09.29
申请人 ALLEN-BRADLEY COMPANY, INC. 发明人 WIELOCH, CHRISTOPHER J.;BABINSKI, THOMAS E.;MATHER, JOHN C.;WOYCHIK, GERARD A.;MCLAUGHLIN, STEVEN R.
分类号 H02M7/00;H05K1/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 H02M7/00
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