| 摘要 |
PROBLEM TO BE SOLVED: To repair a wrong wire in a short time without fail by a method wherein the wire stringed wrongly is cut at the bonded portion and removed, by applying prescribed vibration to a semiconductor device in the process of manufacturing. SOLUTION: In the case when it is found out that a wire 23 is stringed wrongly, a lead frame 21 is transferred to a repairing process 12. The repairing process 12 comprises an all-wire cut-removing process 12-1, a cleaning process 12-2 and a wire re-bonding process 12-3. In the all-wire cut-removing process 12-1, all of the stringed wires 23 are cut and removed by using vibration. In the cleaning process 12-2, the residues of the wires 23 are removed. In the wire re-bonding process 12-3, the wires 23 are stringed again correctly and thereby the repair is completed. In a resin seal process 13, thereafter, the lead frame 21 is set in a mold and molded so that it be sealed into a resin package 24. |
