| 摘要 |
PROBLEM TO BE SOLVED: To facilitate judging whether the packaging is good or not by providing matrix-arranged electrodes and periphery-arranged electrodes. SOLUTION: Matrix-arranged pads 2 are arranged in a matrix or a grid inside a LSI chip 1, allowing the pitch to be rough, while the pitch of periphery- arranged pads 3 disposed at the periphery is narrow. The former pads 2 form bumps to be electrically connected to a substrate with solder and the latter pads 3 for forming connection with Au wires, lead frame, TAB, etc., by the heating or pressing process with a wire bond or gang bond cannot be disposed at an element forming region but at the periphery as the result. Thus, electric connections such as solder bond connections between the pads 3 and pads B" on the substrate 21 can be inspected. |
