Resin-sealed semiconductor device and lead frame used in a resin-sealed semiconductor device

摘要

In a resin-sealed semiconductor device, leads are respectively connected to a plurality of connection electrodes of a semiconductor chip. The leads include a plurality of inner leads respectively connected to the connection electrodes and a plurality of outer leads, first ends of which are connected to the inner leads and second ends of which are connected to an external device. Distal ends of the inner leads have cut-off thin portions, which define a recess for holding the semiconductor chip. The inner leads and the semiconductor chip are covered by a resin sealing material.