| 摘要 |
A jack (50) for a NID module (10) for enabling testing of the interconnected circuits of premise wiring tip and ring wires (26, 28) to circuits of a telephone service provider. Circuits of a circuit element (34) interconnect premise wiring terminals (38, 40) and contacts (30) of service provider circuits, to associated ones of paired contacts (54, 56) of the jack (32), and the contacts are exposed within a plug-receiving cavity of the jack for connection to contacts of a plug during test and otherwise shunted together for in-service use by shunt contacts (60). Each pair of jack contacts (54, 56) is commoned by engagement of the contact arms (76) with a shunt contact (60) mounted along the plug-receiving cavity of the jack during normal operation, and the pair is moved out of engagement with a shunt contact upon insertion of a plug (100) into the jack (50). |
