| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a high-resolution pattern by controlling the dissolution rate of a film formed from a polyamic acid ester and useful for the preparation of a heat-resistant pattern of a micro-circuit of semiconductor, etc. SOLUTION: This resin composition is composed exclusively of a polyamic acid ester derived from a p-substituted aromatic diamine and expressed by the formula I to the formula III [R1 is a tetravalent organic group; R2 is a group of the formula IV (R7 to R10 are each H, CH3 , etc.), etc.; X is a bivalent organic group; R3 is a group of the formula V (R5 is a 2 to 6-valent organic group; (p) is 1-5); R4 is CH3 , C2 H5 , etc.; (x), (y) and (z) are each a percentage of each structural unit and 0<x, y<100, 0<z<80 and x+y+z:100] and N- methyl-2-pyrrolidone. The film of the composition having a thickness of 10μm has a dissolution rate of 0.2-1.5μm/sec in N-methyl-2-pyrrolidone. The light transmittance of the film of the composition of 10μm thick is preferably <=10%, especially <=5% at 365nm wavelength.
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