发明名称 MOLDING METHOD OF CONDUCTIVE RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a conductive resin molding body having high shielding effect of electromagnetic wave, excellent appearance, a molding cycle time whose increase is extremely small by covering a mold wall face which forms a mold cavity of a main mold with an insulating layer formed of a heat resisting polymer having a specified thermal conductivity and a specified thickness. SOLUTION: Injection molding is performed by using a mold, which is formed in such a manner that a mold wall face which forms a mold cavity of a main mold made of metal is covered with an insulating layer to a thickness of 0.01-2mm consisting of a heat resisting polymer having a thermal conductivity of 0.002cal/cm.sec. deg.C or below. A thermoplastic resin as a base is selected from a polyphenylene ether resin, a polystyrene resin, an ABS resin, a polycarbonate resin, and a blend thereof. A conductive filler is selected from metal fiber, metal foil, metal powder, carbon powder, glass fiber having surface coated with metal, and mica plated with metal.
申请公布号 JPH09174613(A) 申请公布日期 1997.07.08
申请号 JP19950336771 申请日期 1995.12.25
申请人 ASAHI CHEM IND CO LTD 发明人 ARAKI SHINICHI;NAKAZAWA KEIICHI
分类号 B29C33/38;B29C45/26;B29C45/73;B29K25/00;B29K55/02;B29K69/00;B29K81/00;B29K105/16;B29L31/34;(IPC1-7):B29C45/26 主分类号 B29C33/38
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