发明名称 Lead-free conductive paste
摘要 A nontoxic lead-free conductive paste comprising (a) a lead-free glass frit having a crystallization temperature of 700 DEG -870 DEG C. and consisting essentially of, by weight %, 20-38% of SiO2, 5.5-13.5% of B2O3, 8-15.5% of Al2O3, 4-19% of CaO, 20-29% of ZnO, 0-6% of ZrO2, 4-16% of TiO2 and 0.1-3.8% of MoO3; (b) finely divided particles of electrically conductive material; (c) at least one inorganic additive selected from the group consisting of bismuth oxide, zinc oxide-containing containing oxide material, manganese oxide, copper oxide and molybdenum oxide; and (d) an organic medium. The nontoxic conductive paste is free from environmental and health problems and results in conductors having excellent solderability, solder leach resistance, adhesion strength and electrical properties, both on ceramic substrates such as alumina or on dielectric bodies.
申请公布号 US5645765(A) 申请公布日期 1997.07.08
申请号 US19960651412 申请日期 1996.05.22
申请人 SHOEI CHEMICAL INC. 发明人 ASADA, EIICHI;TANAKA, TETSUYA
分类号 C09D5/24;H01B1/16;H01B1/22;H05K1/09;(IPC1-7):H01B1/22;H01C7/00 主分类号 C09D5/24
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