| 摘要 |
PROBLEM TO BE SOLVED: To improve flatness and increase throughput by providing multiple boards having at least two polishing faces and a rotatable carrousel, moving the carrousel, and arranging selected one of board heads on selected one of polishing faces. SOLUTION: A polishing system 10 is provided with a polishing device 20 adjacently to a conveying device 30 above, and wafers 40 are conveyed in a cassette 42, stored in a tub 34, carried into a wafer polishing device 20, polished, then returned to the cassette 42. A rotary multi-head carrousel 90 is provided with four wafer head systems, and they receive, hold, and press the wafers to the polishing pads held on platens for polishing. The carrousel 90 has a cross shape, and it is rotated around a carrousel shaft by a motor arranged in a base 22. |
