| 摘要 |
PROBLEM TO BE SOLVED: To provide high flatness and parallelism by a method wherein when the two surfaces of a semiconductor wafer are polished by upper and lower surface plates, a relative speed and load distribution are uniformalized throughout the whole areas of the two surfaces. SOLUTION: A polishing device comprises a carrier 5 to hold a semiconductor wafer 6 in a horizontal state; upper and lower surface plates 2 and 3 brought into slide contact with the upper and under surfaces of the semiconductor wafer 6 and nipping the upper and under surfaces from above and below; a lap member 4 placed on the upper surface plate 2 so that the upper surface plate 2 is rendered relatively horizontally movable; and gear driving mechanisms 9, 10, 21, and 22 to reciprocate the upper and lower surface plates 2 and 3 at a uniformalized relative speed in a direction reverse to each other throughout the whole areas of the upper and the under surfaces of the semiconductor wafer 6. In such a way that the upper and lower surface plates 2 and 3 are linearly moved in a reverse direction to each other, the upper and the under surfaces of the semiconductor wafer 6 are polished at uniform speed distribution and bearing distribution throughout the whole areas of the upper and under surfaces thereof, and machining precision, such as flatness, is excellent. |
