| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive adhesive which has flexibility adaptable to a flexible printed circuit board and gives a cured item excellent in electrical conductivity, adhesive properties, and moisture resistance. SOLUTION: The first conductive adhesive comprises 8-17wt.% glycidyl ether epoxy resin, 1-5wt.% hydrazide curative, and the rest substantially being a silver powder. The second conductive adhesive comprises 8-13wt.% glycidyl ether epoxy resin. 1-5wt.% hydrazide curative, and the rest substantially being a silver-palladium powder.</p> |
