| 摘要 |
PROBLEM TO BE SOLVED: To efficiently polish semiconductor wafers one by one by multi-stage polishing by providing multiple holding shafts holding wafers, and controlling the lifting/lowering of the holding shafts and the fitting/removing of the wafers to/from the holding shafts for each holding shaft. SOLUTION: The first top ring 1a fitted with a wafer 10a is lowered, the first-stage polishing is applied to the wafer 10a, the first top ring 1a is lifted after the specified period elapses, the polishing of the wafer 10a is temporarily interrupted, and a wafer 10b is fitted to the second top ring 1b. The first and second top rings 1a, 1b are lowered, and the second-stage polishing of the wafer 10a and the first-stage polishing of the water 10b are conducted. The first and second top rings 1a, 1b are lifted to interrupt the polishing of the wafers 10a, 10b after the specified period elapses, and a wafer 10c is fitted to the third top ring 1c. All top rings 1a-1c are lowered, the third-stage polishing of the wafer 10a, the second-stage polishing of the wafer 10b, and the first-stage polishing of the wafer 10c are conducted, and the wafer 10a is removed from the first top ring 1a and the next wafer is fitted after the specified period elapses. |
