METHOD FOR AND APPARATUS FOR PROCESSING SEMICONDUCTOR MATERIAL

摘要

PROBLEM TO BE SOLVED: To decrease warpage of a produced semiconductor wafer by a method wherein detergent is introduced onto a working face of a grinding tool at least as two detergent jets which are exposed to acoustic waves of different frequencies. SOLUTION: A plurality of nozzles 2 are faced to a working face 1 of a grinding tool in a direction of sawtooth edge of a circular saw. The nozzle is connected to a storing container 4 storing detergent 5 via a feed duct 3. A sound generating element 6 made of tantalum or piezoelectric ceramic material is provided in each nozzle. Liquid detergent is pressure atomized from the nozzle onto the working face of the grinding tool which is generally rotated in processing of the semiconductor material. Acoustic energy is transmitted to the detergent while it passes through the nozzle. A frequency of the acoustic wave differs according to the element 6 incorporated in the nozzle. Two or ten pieces of nozzles capable of generating acoustic waves of different frequencies are provided.