| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for baking a substrate containing film-forming raw materials, capable of enhancing the yield of the substrate containing the film-forming raw materials by homogeneously heating the substrate. SOLUTION: In the cooling process of the thermal treatment of the substrate 62 containing the film-forming raw materials, the substrate is homogeneously heated at the first set temperature KT1 in the first homogeneous heating process, carried into the second heating chamber 30 maintained at the lower second set temperature KT2 by only a prescribed value of ▵KT than the first set temperature KR1 in a carrying process, and homogeneously heated at the second set temperature KT2 in the second homogeneous heating process. While the substrate is thus repeatedly homogeneously heated in the heating chambers maintained at the set temperatures lowered by only a prescribed value of ▵KT, respectively, the cooling process of the heating treatment is carried out. Thereby, the irregularity of the inner temperature of the substrate 62 containing the film-forming raw materials is reduced as much as possible. When the substrate is produced from glass, the local change in the dimension of the substrate 62 and a position slippage, such as thick film printing, caused by the local change can be prevented to remarkably enhance the production yield. |
