| 摘要 |
PROBLEM TO BE SOLVED: To avoid the stress to a light emitting element array even when irregularity is occurred in the coating amt. of a conductive adhesive by forming a recessed part to the mounting plate of the light emitting element array corresponding to the end part of a light emitting element array. SOLUTION: After a conductive adhesive 4 is applied to the common electrode 5 formed on an insulating substrate 1, light emitting element arrays 3 are linearly mounted on the common electrode 5 by a mounter and the conductive adhesive 4 is cured in a high temp. oven. Notch parts 6 are formed to the places corresponding to the end parts 3a of the respective light emitting element arrays 3 of the common electrode 5. By this constitution, the unnecessary conductive adhesive 4 collects the notch parts 6 becoming recessed parts and does not adhere to the end parts 3a of the light emitting element arrays 3. Therefore, even when a resinous insulating substrate easy to deform by heat is used, no stress is applied to the light emitting element arrays and the lowering of brightness can be prevented. |
