发明名称 SYNTHETIC RESIN HOLLOW BOARD PREPARED BY BONDING PLURAL MATERIALS BY ULTRASONIC FUSION BONDING
摘要 PROBLEM TO BE SOLVED: To simplify the uniting and bonding and to beautifully and effectively fuse by butting the side ends of two thermoplastic resin hollow boards integrally molded from two parallel sheets via many ribs, and ultrasonic fusion bonding them. SOLUTION: The one side ends 2 of two hollow boards 1 are butted, and mounted on a seat 9. An ultrasonic oscillator 8 is moved down and brought into surface pressure contact therewith to maintain the butted state to fix it, and oscillates an ultrasonic wave. The wave is propagated from the sheets 1a of the respective boards 1 to the rear sheets 1d via ribs 1c, the area to be oscillated is melted by the generated heat due to the vibration, and the boards 1 are assimilated by the fusion due to the melting. At this time point, when the oscillation is finished, the melted and assimilated parts are fixed to exhibit a lump-state, united and coupled to form one hollow board 1.
申请公布号 JPH09174688(A) 申请公布日期 1997.07.08
申请号 JP19950349698 申请日期 1995.12.21
申请人 KISHIMOTO SANGYO KK;YUNITEKU:KK 发明人 SAITO TAKESHI;HAGIWARA KENJIRO
分类号 B32B3/12;B29C65/08;B29C67/00;B29L24/00;B29L31/10 主分类号 B32B3/12
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