发明名称 |
Method of making molds for manufacturing multiple-lead microstructures |
摘要 |
A method for making molds for use in manufacturing multiple-lead microstructures is disclosed. Each of the molds comprises a set of punch head molds and a set of matching die plate molds, and the method comprises the steps of (a) dividing the multiple-lead microstructure into a plurality of portions, each portion is to be prepared by a pair of a punch head, which contains a plurality of prutrusions, and a die plate, which contains a plurality of matching recesses; (b) preparing each of the punch head molds using a first lithographic technique; and (c) preparing each of the die plate molds using a second lithographic technique. The first lithographic technique comprises the steps of: (i) forming a thick layer of a photoresist on a baseplate; (ii) irradiating an x-ray of ultraviolet ray onto the photoresist via a first photomask; (iii) developing the photoresist to remove undesired portion thereof; (iv) electroplating a metal or metal-ceramic composite material onto the photoresist that has been developed; (v) removing the photoresist to form a micromold having recesses matching the portion of the microstructure to be prepared. The second lithographic technique involves the same steps except a second photomask, which is conjugate to the first photomask, is used.
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申请公布号 |
US5645977(A) |
申请公布日期 |
1997.07.08 |
申请号 |
US19950532951 |
申请日期 |
1995.09.22 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WU, TUNG-CHUAN;HSIAU, JAR-SIAN;CHOU, MIN-CHIEH;LU, JIING-SONG;LIANG, MU-TIEN |
分类号 |
B29C33/38;B29C33/42;G03F7/00;(IPC1-7):C25D1/10 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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