Verfahren zum Anbringen einer Mehrzahl von Anschlußschichten auf der Außenseite eines Keramik-Bauelements und keramischer Mehrschichtenkondensator
摘要
In this process a conductive first layer composed of finely divided metal and finely divided ceramic material in an organic carrier is applied to a surface of an unsintered ceramic body. The conductive layer forms terminations when the body, and the conductive layer are cofired to sinter and form a unitary, integral, monolithic structure. A second conductive metal layer may be applied to the first layer prior to cofiring to improve attachment capabilities of the component. Leads may be attached to the conductive terminations if desired.
申请公布号
DE4015463(C2)
申请公布日期
1997.07.03
申请号
DE19904015463
申请日期
1990.05.14
申请人
AMERICAN TECHNICAL CERAMICS CORP., HUNTINGTON STATION, N.Y., US
发明人
INSETTA, VICTOR, JACKSONVILLE, FLA., US;MONSORNO, RICHARD V., JACKSONVILLE, FLA., US;DORRIAN, JOHN F., SIMPSONVILLE, S.C., US