| 摘要 |
The process solders area elements, in particular, those of electronic components by means of heat and solder distribution. Heated, molten solder (5) in a container (1) is brought from an initial level into a working level so that a spherical body (6) of lead with specified dimensions is formed. The component (7) with a wettable area element is placed on this spherical body, after which the solder level is reduced to a specified level, and superfluous lead is withdrawn. Also claimed is an apparatus for use in the above process.
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| 申请人 |
HOEHNS, VOLKER, 13053 BERLIN, DE;ROBEL, GUNTRAM, 10437 BERLIN, DE |
发明人 |
DAHLBUDDING, ALEXANDER, 12689 BERLIN, DE;HOEHNS, VOLKER, 13053 BERLIN, DE;ROBEL, GUNTRAM, 10437 BERLIN, DE |
