METHOD FOR THE PRODUCTION OF CONTACTS OF ELECTRICAL COMPONENTS, SAID CONTACTS BEING SUITABLE FOR FLIP-CHIP MOUNTING

摘要

In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable layers (4) in contact with pads of the electrically conductive structures (3) are applied.