WIRE CLAMP

摘要

A wire clamp has two jaws that can be moved with respect to each other by a drive. The jaws are provided with surfaces for clamping and moving or holding bond wires of various diameters for ultrasonic wire bonding devices in which the wire clamp is arranged directly behind a bonding tool (wedge). One of the jaws (2) of the wire clamp (1) is joined to the bonding device in an adjustable manner in relation to the bonding wire (12) and the second movable jaw (3) is joined by a parallel guide to the first jaw (2) in such a way that the jaws (2, 3) may be moved away from each other and closed transversely to the longitudinal direction of the bonding wire (12). The invention also relates to such a wire clamp joined by a parallel guide to the bonding device or head.