发明名称 |
Polyimide-metal foil composite film |
摘要 |
<p>A polyimide-metal foil composite film comprising a conductive metal foil having directly laminated on at least one surface thereof a polyimide resin layer which comprises repeating units represented by formulae (1) and (2) as described hereinabove. The polyimide-metal foil composite film can be used as a circuit substrate having excellent dimensional stability under high temperature.</p> |
申请公布号 |
EP0782376(A2) |
申请公布日期 |
1997.07.02 |
申请号 |
EP19960120283 |
申请日期 |
1996.12.17 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
HIGASHI, KAZUMI;MOCHIZUKI, AMANE |
分类号 |
B32B15/08;B32B15/088;B32B27/04;B32B27/06;B32B27/34;C08G73/10;H05K1/03;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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