| 发明名称 |
HIGH TEMPERATURE LEAD-FREE TIN BASED SOLDER COMPOSITION |
| 摘要 |
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi. |
| 申请公布号 |
KR970010891(B1) |
申请公布日期 |
1997.07.02 |
| 申请号 |
KR19940011318 |
申请日期 |
1994.05.24 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
GONYA, STEPHEN G.;LAKE, JAMES K.;LONG, RANDY C. |
| 分类号 |
B23K35/26;C22C13/00;H01L21/60;H01L23/488;H05K3/34;(IPC1-7):B23K35/22 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
