发明名称 |
Method of fabricating semiconductor device |
摘要 |
The present invention encompasses a semiconductor processing device having a processing chamber in which is positioned an electrolyte oxygen pump assembly and tubing for transferring an oxygen containing gas from outside the reaction chamber to within the interior of the electrolyte oxygen pump assembly and tubing for removal of the oxygen depleted gas from within the interior of the electrolyte oxygen pump assembly. In addition, the semiconductor processing tool may further have heating elements for heating a semiconductor substrate within the processing chamber independently from heating of the electrolyte.
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申请公布号 |
US5643435(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19960673021 |
申请日期 |
1996.07.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GUHMAN, GLENN F.;JOSHI, MADHUKAR L. |
分类号 |
B01D53/32;C23C16/44;C23C16/448;(IPC1-7):C25D11/32;C25D9/00;H01L21/465 |
主分类号 |
B01D53/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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