发明名称 Expandable resin composition
摘要 A process for preparing an expandable resin composition comprising the following steps: (a) admixing, at a temperature in the range of about 120 to about 130 degrees C., the following components: (i) 100 parts by weight of a high pressure, low density homopolymer of ethylene; (ii) about 30 to about 200 parts by weight of a high density polyethylene having a melting point higher than the above mixing temperature; (iii) about 2 to about 50 parts by weight of polypropylene having a DSC melting point of not less than about 140 degrees C.; and (iv) about 0.1 to about 2 parts by weight of a silane coupling agent; and (b) admixing, at a temperature in the range of about 120 to about 130 degrees C., 100 parts by weight of the mixture produced in step (a) with 0.5 to 3 parts by weight of one or more chemical blowing agents having a decomposition temperature higher than the above mixing temperature.
申请公布号 US5643969(A) 申请公布日期 1997.07.01
申请号 US19960678777 申请日期 1996.07.11
申请人 NIPPON UNICAR COMPANY LIMITED 发明人 SAKAMOTO, TOSHIO;INOUE, TATSUHIKO;YOSHIDA, MAMORU
分类号 B29C47/02;C08J9/00;C08J9/06;C08J9/10;C08K5/43;C08K5/54;C08L23/00;C08L23/04;C08L23/06;C08L23/10;H01B3/30;H01B3/44;(IPC1-7):C08J9/10;C08J9/12 主分类号 B29C47/02
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