发明名称 |
Pneumatic polishing head for CMP apparatus |
摘要 |
A polishing head for chemical-mechanical polishing apparatus includes a carrier plate having concentric, integral, cylindrical walls, an annular piston fitting within the outer of the cylindrical walls and a second piston fitting within the inner cylindrical wall and engaging the annular piston. Each piston defines a chamber with the carrier plate and the chambers are isolated from each other by a seal. Pneumatic fittings supply air or vacuum to each chamber. The second piston includes a cylindrical side wall and an integral bottom plate. The bottom plate is thicker in the center than at the side wall and the underside of the plate is covered with a wafer adhering layer. A retaining ring is attached to the lower edge of the annular piston. The retaining ring includes a peripheral groove for separating an outwardly extending flange from the main body of the ring. The underside of the ring includes one or more spiral grooves for circulating slurry about a wafer during polishing.
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申请公布号 |
US5643061(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19950504686 |
申请日期 |
1995.07.20 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORPORATION |
发明人 |
JACKSON, PAUL DAVID;SCHULTZ, STEPHEN CHARLES |
分类号 |
B24B37/04;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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