发明名称 Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip
摘要 After a metallic insert has been used precisely to define a cavity for a microelectronic chip in a laminated, multi-sheet, predominantly ceramic substrate having metallic features, any green sheet and metal-polymer composite paste residues are removed from the metallic insert by immersing the metallic insert in an ultrasonically agitated bath containing a first solvent having a relatively high boiling point for about five to fifteen minutes, replacing the first solvent with a second solvent having a relatively low boiling point, and drying the metallic insert in hot air or hot nitrogen to remove the second solvent. Preferably, the first solvent is an alkoxy alcohol, such as 1-methoxy-2-propanol or 3-methoxy-1-butanol, or a hydroxy ester, such as ethyl lactate, and the second solvent is a lower alkyl alcohol, such as isopropanol. Alternatively, the first solvent may be a ketone or an alkyl ester. The metallic insert is rinsed in the second solvent, preferably in an ultrasonically agitated bath, to replace the first solvent with the second solvent before the metallic insert is dried to remove the first solvent.
申请公布号 US5643818(A) 申请公布日期 1997.07.01
申请号 US19960642238 申请日期 1996.05.02
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SACHDEV, KRISHNA G.;LOMBARDI, THOMAS E.;PETERSON, VINCENT P.
分类号 H01L21/48;(IPC1-7):H01L21/70 主分类号 H01L21/48
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