发明名称 |
Epoxy resin compositions and cured products |
摘要 |
An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.
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申请公布号 |
US5643975(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19950413929 |
申请日期 |
1995.03.30 |
申请人 |
SHIN-ETSU CHEMICAL COMPANY, LIMITED |
发明人 |
SHIOBARA, TOSHIO;SHIMIZU, HISASHI |
分类号 |
C08G59/62;C08F24/00;C08F30/08;C08F224/00;C08F230/08;C08F291/02;C08G59/00;C08G59/20;C08G59/32;C08L51/00;C08L63/00;C09J163/00;(IPC1-7):C08L9/02 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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