| 摘要 |
<p>A method of manufacturing a multilayered printed-wiring-board comprises attaching conductive members (136a, 136b; 236a, 236b; 336; 436a, 436b; 542, 642) on conductive layers (228, 230; 328, 330; 428, 430; 528, 530) superimposing a plurality of printed-wiring boards, (220, 222; 320, 322; 420, 422; 520, 522) and electrically connecting the conductive layers (228, 230; 328, 330; 428, 430; 528, 530) with one another by the conductive members (136a, 136b; 236a, 236b; 336; 436a, 436b; 542, 642).</p> |
