| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency in radiation and making an area of radiating part small on a board while the whole size of a heat radiating device is reduced, by using a heat radiating plate projected outside from a heat conductive plate in a heating body. SOLUTION: A heat sink 24 made up of a heat conductive plate 25 and each radiating plate 28 is formed on a substrate 22. The substrate 22 is fixed to a supporting stage 21 with an adhesive layer 23 in between. The heat conductive plate 25 is fixed to the substrate 22 with a solder layer 26 in a way that each radiating plate 28 is projected outside from inserting hole 22A or 21A of the substrate 22 or the supporting stage 21. The transistor 6 is fixed on the heat conductive plate 25 with a solder layer 27 in between. A source 8 and a gate 9 of the transistor 6 are connected to each wiring pattern on the substrate 22 with bonding wires 29 and 30, while a drain 10 is connected to a wiring pattern on the substrate 22 with the radiating plate 25 in between. |
