| 摘要 |
PROBLEM TO BE SOLVED: To prevent a heat sink from moving outside at the time of resin- sealing. SOLUTION: A semiconductor chip 2 is bonded on the die pad 1 of a lead frame with silver paste adhesive 3, and a heat sink 4 is bonded between the protruding parts 9 provided at the bottom of the die pad 1 with adhesive 5. Then, the semiconductor chip 2 and the lead 6 of the lead frame are electrically connected by bonding wire 7, and the outer part is sealed by sealing resin 8. This structure permits a layer of the adhesive 5 to receive sealing pressure even in the resin sealing process, and prevents the heat sink 4 from flowing by the sealing resin even when the layer of the adhesive 5 is removed from the die pad 1. Thus, the heat sink 4 is prevented from removing from the bottom of the die pad 1, and resin-sealing is performed at the correct position. |
