| 摘要 |
PROBLEM TO BE SOLVED: To improve the manufacturing yield of a semiconductor device which stores a plurality of semiconductor chips in a flat type package by replacing defective semiconductor chips with nondefective semiconductor chips. SOLUTION: On an insulator frame 6 provided with a gate liner 7, four square aligning guides 5 are fit and aligned making contact with one another, and a semiconductor element 20 and a contact terminal 4 are aligned by each aligning guide 5. The semiconductor element 20 is composed of a semiconductor chip 3, solder 2 and a supporting board 1. A semiconductor unit 30 is composed of the semiconductor element 20, a contact terminal 4 and the aligning guide 5. When a defect is generated on the semiconductor element, the defective semiconductor unit is replaced with a nondefective semiconductor unit 31, which is composed of a nondefective semiconductor element which has the same thickness as that of the nondefective semiconductor element not to be replaced, and a nondefective semiconductor device is provided. |
