BONDING APPARATUS

摘要

A bonding apparatus used in manufacturing semiconductor devices, etc. including an ultrasonic horn mounted to a bonding arm of the bonding apparatus via a horn support. The ultrasonic horn is provided with a bonding tool at one end and a vibration-generating source at another end, and respective values of vibrational wavelengths on both sides of the horn support are set so that the value on the bonding tool side of the horn support is 7 or greater relative to a value of 3 on the opposite side of the horn support from the capillary. In other words, the distance from the horn support to the end of the vibration-generating source is set to be 1/4 of the wavelength, and the distance from the horn support to the end of the horn where the bonding tool is attached is set to be 3/4 of the wavelength.