RESIN SEALING-TYPE ELECTRONIC PARTS,申请号JP19950349625-传众专利搜索

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发明名称	RESIN SEALING-TYPE ELECTRONIC PARTS
摘要
申请公布号	JPH09172109(A)	申请公布日期	1997.06.30
申请号	JP19950349625	申请日期	1995.12.20
申请人	SANKEN ELECTRIC CO LTD	发明人	YOSHIZAKI SHIGEO
分类号	H01L23/28;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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