| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device as a whole by using resistors to which wires can be bonded directly. SOLUTION: In a semiconductor device which is provided with a substrate 1, a resin case 3, a circuit board 20, switching elements T1-T3, a signal terminal board S1, and resistors R10-R30, each resistor R10-R30 has an insulator plate, a resistance layer which is selectively provided on one main surface of the insulator plate and composed of a metallic thin film, a first electrode layer which is provided only on one main surface of the insulator plate and connected to the resistance layer as one current inputting-outputting section of the resistance layer, and a second electrode layer which is provided across both main surfaces of the insulator plate and connected to the resistance layer as the other current inputting-outputting section of the resistance layer. The resistors R10-R30 are electrically connected to control electrodes by directly connecting the control electrodes to the first electrode layers through bonded wires WL. |
