SEMICONDUCTOR CHIP, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To block an adhesive agent from creeping up to the surface of a semiconductor chip being mounted on a support through the adhesive agent. SOLUTION: A semiconductor chip 1 has a stepped part at the side face along the thickness thereof and this part has a recess along the marginal edge of the back face of the chip 1. When the chip is mounted, an adhesive agent extruding to the marginal edge of this back face melts and is stored in the recess. The chip 1 having such shape can be produced, using a second dicing blade to dice from the back face 7B of a semiconductor wafer 7, this blade being thicker than that of a first dicing blade to dice from the front face 7A in dicing of the wafer 7.