| 摘要 |
PROBLEM TO BE SOLVED: To release a wafer without contact of the wafer to a solid object by setting the atmospheric pressure on the surface side of the wafer lower than the pressure at a part where the wafer is sucked to a wafer holder and releasing the wafer in the process, wherein a load is applied on the back surface of the wafer and the surface of the wafer is flattened and polished. SOLUTION: A wafer 1 is mounted on a wafer holder 15, through an elastic backing pad 14 by water filling and polished. After the polishing, the wafer 1 is set on a negative-pressure chamber for releasing the wafer 1 from the wafer holder 15. At this time, the boundary between the wafer holder 15 and the negative-pressure chamber 18 is set through a tightly-closed holder 20 for keeping the closing degree. After the end of the polishing, the air in the negative-pressure chamber 18 is sucked through a sucking port 19, and the pressure is made lower than the surrounding atmospheric pressure. Then the wafer 1 is released from the elastic backing pad 14. The released wafer 1 is received by a wafer receiving jig 21. In this way, the release of the wafer is automated, and the occurrence of flaws on the surface of the wafer can be prevented. |
