发明名称 MANUFACTURE OF MULTILAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board, which laminates a prepreg on an internal layer board performed a treatment for performing a reduction treatment after an oxidation treatment, heats, presses and molds the laminated material to manufacture the multilayer board, does not make a spot form on an internal layer pattern and obtains the multilayer board of a good finish from the viewpoint of visual appearance. SOLUTION: A water-soluble photosensitive resist is performed on the surface of a copper-clad laminated board and after the resist is exposed, it is subjected to developing and etching, then, the resist is peeled from the surface of the laminated board using a release agent containing a defoaming agent to form an internal layer board having an internal layer pattern on its surface and after a treatment for performing a reduction treatment after an oxidation treatment is performed on the internal layer board, a prepreg is laminated on the internal layer board and the laminated material is thermocompressed and is molded to manufacture a multilayer board.
申请公布号 JPH09172256(A) 申请公布日期 1997.06.30
申请号 JP19950333001 申请日期 1995.12.21
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ONISHI NOBUMITSU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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