发明名称 ELECTRICAL PART JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To conduct a quick and regeneratable bonding of an electrical component even to the area of the smallest contact part by a method wherein a laser beam, which is provided in an optical fiber system, is irradiated on a bonding place and two contact elements are electrically connected with each other without using solder. SOLUTION: An FDC laser system 200 consists of an Nd:YAG laser or a laser 202 of a diode and is provided with an optical film 204. The system guide a laser beam 220 to a connection point 206 through the fiber 204. The optimum heat coupling in an electrical component is found by a method wherein two contact parts are pushed together by the fiber 204 and the interval between a lead wire 208 for tape automation bonding use and a casting pad 210 is reduced to zero. The beam 220 reflected at the contact 206 is made a beam division 214 through a lens 216, is made to pass through a lens 222 and is subjected to infrared detection 212. Then, the beam is inputted in a PC controller 224, is monitored 226, a feedback temperature loop is formed and a laser parameter is controlled. Thereby, the assembly of the electrical component is facilitated and the yield and reliability of the component are enhanced.
申请公布号 JPH09172034(A) 申请公布日期 1997.06.30
申请号 JP19960283494 申请日期 1996.10.25
申请人 HEWLETT PACKARD CO (HP) 发明人 MOHAMATSUDO AKUHABUEIN;GATSUSEN AZUDASHIYUTO
分类号 B23K26/00;B23K26/08;B23K26/20;B23K26/22;B41J2/16;H01L21/60;H01R43/02;H05K3/32 主分类号 B23K26/00
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