| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed-wiring board, which laminates boards to form each gold film on conductor circuits in an electronic component housing hole, can prevent the generation of an abnormal precipitation of plated metal films at the time when an electrolytic plating is applied to through holes, thus decreasing the occurrence of an improper short circuit. SOLUTION: A multilayer printed-wiring board is manufactured in such a way that the processes ranging from the following process (1) to the process (5) are provided. (1) Trough holes 3 are formed in a multilayer board 15 formed with the through holes 3 in such a way that they are exposed through the multilayer board 15 to cover an electronic component housing hole 2 with film bodies, such as dry film bodies 8. (2) plated catalysts 6 are respectively given to the holes 3 using a plating pretreating liquid, then, a plating is applied to the holes 3 to form metal films 9. (3) Metal film pieces 11 precipitated on the film bodies 8 are removed. (4) The remaining film bodies 8 are removed. (5) Gold films are respectively formed on conductor circuits 4 in the hole 2.</p> |
