| 摘要 |
In a process for producing plated-through single- or multi-layered circuit boards comprising a polymer base or ceramic which is coated, possibly on both sides, with at least one photoresist layer which temporarily exposes electrically conductive circuit pattern, a metallic layer is deposited electrolytically or non-electrolytically on the surfaces of the base, including those which are not coated with a conducive metallic layer. The process is characterized in that (a) the surface of the base is drilled, subjected to a mechanical surface treatment, laminated with a suitable photoresist, liminated and developed, in order to expose the circuit pattern, (b) the surfaces of the base are pretreated in an oxidizing solution, (c) the solvent residues are rinsed off the base, which is then placed in a solution containing a heterocyclic monomer, in particular pyrrol, thiophene, furan or their derivatives, which in polymer form is electically conductive, (d) the base is then placed in an acidic solution in which an electrically conductive polymer is formed, the solvent residues are rinsed off, and the drilled holes and circuit pattern are metallized preferably electrolytically or non-electrolytically. |
