| 摘要 |
<p>PROBLEM TO BE SOLVED: To mass-produce modules while ensuring the merit of a protruding part by forming a through-hole to an insulating sheet substrate and depositing conductive ink on the first surface of the substrate to partially fill the through- holes and printing mutually connected patterns on the second surface thereof to fill the through-holes. SOLUTION: The electric contact 13 on the first surface of a substrate sheet has a plurality of regions 13a-13h and the respective regions are placed on respective through-holes 12a-12h and the through-holes are partially filled with conductive ink by silk screen printing using the conductive ink. After heat treatment, second silk screen printing inherent to an integrated circuit of a given form is applied to the second surface of the sheet. These patterns connect the outlets of the through-holes 12 of the second surface and the connection pads arranged in order to receive the protruding parts of flip chips mutually electrically and the respective protruding parts and the respective electric contact regions are electrically connected. Finally, the flip chips are attached on the connection pads of the respective mutually connected patterns.</p> |
