发明名称 LUMPY FILLING MATERIAL AND PRODUCTION THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To reutilize a polystyrene-contg. material, especially its scrap as a polystyrene-contg. lumpy filling material having high adhesion to a hydrophilic material such as concrete. SOLUTION: This lumpy filling material has a structure formed by coating the surface of a polystyrene-contg. lumpy body with chips of an org. porous body, preferably a polystyrene-contg. porous body or chips of an inorg. substance such as rock or hardened mortar. In the case of inorg. substance, a styrene- contg. polymer having polar groups is preferably allowed to exist on at least a part of the interface between the polystyrene-contg. lumpy body and chips of the inorg. substance.</p>
申请公布号 JPH09169553(A) 申请公布日期 1997.06.30
申请号 JP19950350113 申请日期 1995.12.21
申请人 SONY CORP 发明人 WATANABE HARUO;NOGUCHI TSUTOMU
分类号 C04B18/20;C04B20/10;(IPC1-7):C04B18/20 主分类号 C04B18/20
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