| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having bonding performance excellent in heat resistance even in a thin substitution type Au plating layer. SOLUTION: A bonding printed-wiring board having copper foil or copper plating as an underneath layer on a resin or ceramic or various kinds of metals, further having Ni alloy plating, PD plating, Au plating as a surface layer to be a substitution type non-electrolytic plating is featured by providing porus substitution type non-electrolytic palladium layer in thickness of 0.03-1μm as for the underneath Pd of said Au plating.
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