| 摘要 |
A lead frame and a package of a semiconductor device capable of improving a design free rate of inner leads of a lead frame suitable to change a layout design of a chip are disclosed. The lead frame of a semiconductor device is connected to inner leads(24) through a bonding pad of a semiconductor chip(21) and a first wire(23). An insulating film(28) is attached on a plurality of inner leads(24) each having a predetermined length. A plurality of floating inner leads(27) are stacked on the insulating film(28). The plurality of floating inner leads(27) each have a predetermined length.
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