| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a bonding connection consisting of a semiconductor chip, which is adhered with a plurality of pieces of solder balls, and a lower filler material layer, which is bonded between the upper surface of a printed circuit board and the chip and are formed with a plurality of holes bored therein, on the board of a semiconductor element to increase the adhesive force of the interface between the structure and the printed circuit board. SOLUTION: A flat lower filler material layer 14 and a semiconductor chip 18 adhered with a plurality of solder balls 16 are bonded and laminated in order on the upper surface of a printed circuit board 13. The layer 14 is formed into a rectangular form and a plurality of pieces of holes 15 are bored and formed in the surface of the layer 14 into the form of matrix at prescribed intervals. The shape of the holes 15 is conformed to that of the balls 16. A plurality of pieces of the balls 16 are adhered and formed on the upper surface of the chip 18 and balls 16 are respectively inserted in each hole 15. The height of the layer 14 is made lower than that of the balls 16. Thereby, the productivity of a bonded connection structure on the board of a semiconductor element is enhanced by a simple production method, the cost of the structure is reduced and the adhesive force of the interface between the structure and the board 13 is increased.</p> |
